Origin:Mainland China Product Size:180*30*35mm Package Size:187*31*31mm Product Usage::Specially developed for mobile phone motherboard chipsand mid layer back soldering Product capacity:10CC Product Color:Semitransparent yellow paste Product Model:P23 P59 MECHANIC 10CC Soldering Paste P23 Special Oil for Chip P59 Reflow Soldering Aid for PCB BGA Repair Needle Barrel Flux Oil P23: Special oil for chip repair Specially developed for the repair of mobile phone motherboard chips and middle layers, using high activity, low halogen, and lead-free materials with moderate fluidity High temperature heating, good material wettability, perfect solution for chip disassembly and soldering, completely non-destructive without damaging the motherboard and chip P59: Special soldering oil for chip reflow Specially developed for mobile phone motherboard chips and mid layer soldering, using medium activity, lead-free and halogen-free materials with strong flowability Chip reflow has a significant effect, which can enhance the adhesion between chip pins and solder pads, enabling automatic homing and alignment of chip reflow, especially for BGA reflow, with a more significant homing effect